Semiconductor
The composite current collector features a sandwich structure design comprising a polymer substrate (e.g., PET/PP) with a nano-metal coating (Cu/Al). Its thickness can be precisely controlled between 6–8μm (significantly lower than the 12μm of traditional copper foil), reducing surface density by over 50%. In semiconductor packaging and high-end electronics, this material can replace traditional copper foil, substantially reducing circuit substrate weight. It is particularly suitable for applications demanding extreme lightweighting and space utilization, such as wearable medical devices (e.g., EEG monitoring headbands) and foldable smartphones.